Sealed air gap for semiconductor chip

US8390079B2 · kind B2 · utility

Assignee

• International Business Machines Corporation · US

Inventors

• David V. Horak · South Burlington, US
• Elbert E. Huang · Carmel, US
• Charles W. Koburger, III · Delmar, US
• Douglas C. La Tulipe, Jr. · Albany, US
• Shom Ponoth · Irvine, US

Key dates

• Filing date: Oct 28, 2010
• Grant date: Mar 5, 2013
• Expiry date: Jan 5, 2031

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10D84/038

Abstract

A semiconductor chip including a substrate; a dielectric layer over the substrate; a gate within the dielectric layer, the gate including a sidewall; a contact contacting a portion of the gate and a portion of the sidewall; and a sealed air gap between the sidewall, the dielectric layer and the contact.