Wafer bonding method
US8390111B2 · kind B2 · utility
1Cited by
4References
22Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 23, 2007 |
| Grant date | Mar 5, 2013 |
| Priority date | — |
| Expiry date | Oct 14, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16235
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
One embodiment of a micro-electronic device includes a substrate including micro-electronic components thereon, and a cover including a ring of sealing material secured to the substrate and a raised ring of material positioned opposite the cover from the ring of sealing material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.