Bonding film composition for semiconductor assembly, bonding film therefrom, and dicing die bond film comprising the same
US8394493B2 · kind B2 · utility
1Cited by
3References
10Claims
0Family size
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Key dates
| Filing date | Jul 19, 2007 |
| Grant date | Mar 12, 2013 |
| Priority date | — |
| Expiry date | Dec 2, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31511
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A die bonding film composition for semiconductor assembly may include an elastomer resin containing a hydroxyl group, a carboxyl group, or an epoxy group. The die bonding film composition may also include a film forming resin having a glass transition temperature (Tg) in the range of about 0 to 200° C., an epoxy resin, a phenol resin, a hardener, a silane coupling agent, and a filler.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.