Patent · US Active

Semiconductor device

US8394673B2 · kind B2 · utility

0Cited by

2References

18Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Gerhard Poeppel · Duggendorf, DE
Irmgard Escher-Poeppel · Regensburg, DE

Key dates

Filing date	Apr 30, 2012
Grant date	Mar 12, 2013
Priority date	—
Expiry date	Apr 30, 2032

Classification

Technology area (CPC H)Electricity
CPC primaryH03H9/0547
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A method of manufacturing a semiconductor device is disclosed. One embodiment includes placing multiple semiconductor chips onto a carrier, each of the semiconductor chips having a first face and a second face opposite to the first face. An encapsulation material is applied over the multiple semiconductor chips and the carrier to form an encapsulating body having a first face facing the carrier and a second face opposite to the first face. A redistribution layer is applied over the multiple semiconductor chips and the first face of the encapsulating body. An array of external contact elements are applied to the second face of the encapsulating body.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.