Method and system for implementing virtual metrology in semiconductor fabrication
US8396583B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 25, 2010 |
| Grant date | Mar 12, 2013 |
| Priority date | — |
| Expiry date | Jun 15, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L22/20
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present disclosure provides a method of fabricating a semiconductor device. The method includes collecting a plurality of manufacturing data sets from a plurality of semiconductor processes, respectively. The method includes normalizing each of the manufacturing data sets in a manner so that statistical differences among the manufacturing data sets are reduced. The method includes establishing a database that includes the normalized manufacturing data sets. The method includes normalizing the database in a manner so that the manufacturing data sets in the normalized database are statistically compatible with a selected one of the manufacturing data sets. The method includes predicting performance of a selected one of the semiconductor processes by using the normalized database. The selected semiconductor process corresponds to the selected manufacturing data set. The method includes controlling a semiconductor processing machine in response to the predicted performance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.