Linearly distributed semiconductor workpiece processing tool
US8398355B2 · kind B2 · utility
17Cited by
52References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 26, 2006 |
| Grant date | Mar 19, 2013 |
| Priority date | — |
| Expiry date | Nov 29, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6719
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate processing apparatus includes a transport chamber capable of holding an isolated atmosphere therein and communicably connected to a charging station for loading and unloading a substrate into the apparatus, a transport system inside the transport chamber for transporting the substrate and an array of processing chamber modules distributed alongside the transport chamber and communicably connected to the transport chamber to allow the substrate to be transferred therebetween.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.