Semiconductor wafer composed of monocrystalline silicon and method for producing it
US8398766B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 27, 2009 |
| Grant date | Mar 19, 2013 |
| Priority date | — |
| Expiry date | Oct 23, 2031 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC30B33/02
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Semiconductor wafers composed of monocrystalline silicon and doped with nitrogen contain an OSF region and a Pv region, wherein the OSF region extends from the center radially toward the edge of the wafer as far as the Pv region; the wafer has an OSF density of less than 10 cm−2, a BMD density in the bulk of at least 3.5×108 cm−3, and a radial distribution of the BMD density with a fluctuation range BMDmax/BMDmin of not more than 3. The wafers are produced by controlling initial nitrogen content and maintaining oxygen within a narrow window, followed by a heat treatment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.