Non destructive selective deposition removal of non-metallic deposits from aluminum containing substrates
US8398779B2 · kind B2 · utility
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Key dates
| Filing date | Feb 19, 2010 |
| Grant date | Mar 19, 2013 |
| Priority date | — |
| Expiry date | May 7, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P20/582
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Non-metallic deposits are selectively removed from aluminum containing substrates such as aluminum faceplates using a selective deposition removal (SDR) solution. The SDR solution does not substantially etch the faceplate holes, thereby preserving the hole diameter integrity and increasing the number of times the faceplate may be cleaned or refurbished while remaining within processing hole diameter tolerances. In an embodiment, the SDR solution comprises, in wt % of the solution, 15.5%+/−2% HF or buffered HF acid, 3.8%+/−0.5% NH4F pH buffer, 59.7%+/−5% ethylene glycol, and the balance H2O.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.