Alignment inspection
US8399264B2 · kind B2 · utility
2Cited by
2References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 30, 2010 |
| Grant date | Mar 19, 2013 |
| Priority date | — |
| Expiry date | Nov 30, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/161
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present disclosure relates to the field of microelectronic substrate fabrication and, more particularly, to alignment inspection for vias formed in the microelectronic substrates. The alignment inspection may be achieved by determining the relative positions of fluorescing and non-fluorescing elements in a microelectronic substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.