Methods for packaging light emitting devices and related microelectronic devices
US8399267B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Dec 23, 2010 |
| Grant date | Mar 19, 2013 |
| Priority date | — |
| Expiry date | Feb 11, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/8514
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for forming a light emitting device includes providing a light emitting diode (LED) configured to emit light of a first color and providing a plurality of semi-spherical lenses made of a silicone material that contains no phosphor material. Each of the lenses has a layer of phosphor material attached thereto. The method also includes testing the plurality of lenses to select a subset of lenses that converts light of the first color to light of a second color. The method further includes forming the light emitting device using the LED, one of the selected subset of lenses, and a heat conductive substrate. In an embodiment, after the testing of the plurality of lenses, one of the selected subset of lenses is disposed overlying the LED. In another embodiment, the testing of the plurality of lenses is conducted with a light source other than the LED.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.