Underfill device and method
US8399291B2 · kind B2 · utility
1Cited by
10References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 29, 2005 |
| Grant date | Mar 19, 2013 |
| Priority date | — |
| Expiry date | Nov 14, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An underfill device and method have been are provided. Advantages of devices and methods shown include dissipation of stresses at an interface between components such as a chip package and an adjacent circuit board. Another advantage includes faster manufacturing time and ease of manufacture using underfill devices and methods shown. An underfill assembly can be pre made with conductive structures included within the underfill assembly. Steps such as flowing epoxy and curing can be eliminated or performed concurrently with other manufacturing steps.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.