Microelectronic devices including conductive vias, conductive caps and variable thickness insulating layers
US8399987B2 · kind B2 · utility
12Cited by
6References
41Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 22, 2010 |
| Grant date | Mar 19, 2013 |
| Priority date | — |
| Expiry date | Dec 8, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19041
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Microelectronic devices include a conductive via that extends into a substrate face and that also protrudes beyond the substrate face to define a conductive via end surface and a conductive via sidewall that extends from the end surface towards the substrate face. A conductive cap is provided on the end surface, the conductive cap including a conductive cap body that extends across the end surface and a flange that extends from the conductive cap body along the conductive via sidewall towards the substrate face. Related fabrication methods are also described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.