Yonghwan Kwon
39Patents
14h-index
38Co-inventors
77Inventor score
Filing activity: Aug 12, 2009 → Apr 6, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| USD698360S1 | Display screen or portion thereof with animated graphical user interface | General | 156 | Active |
| USD695755S1 | TV monitor with graphical user interface | General | 90 | Active |
| USD742901S1 | TV display screen displaying GUI | General | 81 | Active |
| USD735220S1 | TV display screen displaying GUI | General | 71 | Active |
| USD697927S1 | Display screen or portion thereof with animated graphical user interface | General | 53 | Active |
| USD697926S1 | Display screen or portion thereof with animated graphical user interface | General | 38 | Active |
| USD735739S1 | TV display screen displaying GUI | General | 34 | Active |
| USD749605S1 | TV display screen displaying GUI | General | 34 | Active |
| USD733725S1 | TV display screen displaying GUI | General | 32 | Active |
| USD734346S1 | TV display screen displaying GUI | General | 30 | Active |
| USD733726S1 | TV display screen with an animated graphical user interface | General | 27 | Active |
| USD742900S1 | TV display screen displaying graphical user interface | General | 18 | Active |
| USD936089S1 | Display screen or portion thereof with graphical user interface | General | 17 | Active |
| US8105934B2 | Bump structure for a semiconductor device and method of manufacture | Electricity | 14 | Active |
| US8399987B2 | Microelectronic devices including conductive vias, conductive caps and variable thickness insulating layers | Electricity | 12 | Active |
| USD733729S1 | TV display screen with graphical user interface | General | 11 | Active |
| USD734347S1 | TV display screen displaying GUI | General | 6 | Active |
| US9142498B2 | Semiconductor devices having stacked solder bumps with intervening metal layers to provide electrical interconnections | Electricity | 5 | Active |
| US9972605B2 | Method for fabricating fan-out wafer level package and fan-out wafer level package fabricated thereby | Electricity | 4 | Active |
| US10186500B2 | Semiconductor package and method of fabricating the same | Electricity | 3 | Active |
| US9972580B2 | Semiconductor package and method for fabricating the same | Electricity | 2 | Active |
| US8587108B2 | Package for semiconductor device including guide rings and manufacturing method of the same | Electricity | 2 | Active |
| US11545440B2 | Semiconductor package | Electricity | 1 | Active |
| US9159688B2 | Semiconductor device including a solder and method of fabricating the same | Electricity | 1 | Active |
| US11569137B2 | Semiconductor packages | Electricity | 1 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.