Semiconductor chip and semiconductor package having the same
US8399994B2 · kind B2 · utility
11Cited by
8References
36Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 28, 2011 |
| Grant date | Mar 19, 2013 |
| Priority date | — |
| Expiry date | Oct 28, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor chip includes a body part having a first surface and a second surface facing away from the first surface, and an opening passing from the first surface to the second surface of the body part.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.