Wafer level contactor
US8400176B2 · kind B2 · utility
4Cited by
17References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 18, 2009 |
| Grant date | Mar 19, 2013 |
| Priority date | — |
| Expiry date | Dec 25, 2029 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/54
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A probe card assembly can include a plurality of probes disposed on a substrate and arranged to contact terminals of a semiconductor wafer. Switches can be disposed on the probe card assembly and provide for selective connection and disconnection of the probes from electrical interconnections on the probe card assembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.