Bypass thermal adjuster for vacuum semiconductor processing
US8403613B2 · kind B2 · utility
68Cited by
19References
19Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 5, 2007 |
| Grant date | Mar 26, 2013 |
| Priority date | — |
| Expiry date | Sep 28, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68792
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A bypass thermal adjuster, which may be placed between two robots, provides a chamber for isolation and thermal control of wafers while permitting other wafers to be passed through the adjuster by the robots.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.