Plasma cleaning for process chamber component refurbishment
US8404135B2 · kind B2 · utility
0Cited by
8References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 26, 2008 |
| Grant date | Mar 26, 2013 |
| Priority date | — |
| Expiry date | Apr 9, 2031 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C16/4404
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method for cleaning and refurbishing a chamber component includes placing a chamber component having process deposits on an exterior surface in a plasma vapor deposition chamber. The chamber component is bombarded with a plasma comprising Argon for a period of time sufficient to remove the process deposits from the exterior surface of the chamber component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.