Patent · US Active

Low-inductive semiconductor module

US8405206B1 · kind B1 · utility

8Cited by

10References

14Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Thomas Duetemeyer · Soest, DE
Thomas Auer · Metnitz, AT
Georg Braeker · Warstein, DE
Ronny Herms · Haldensleben, DE

Key dates

Filing date	Sep 30, 2011
Grant date	Mar 26, 2013
Priority date	—
Expiry date	Sep 30, 2031

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/19107
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A semiconductor module includes a module housing, at least one substrate, a number N of at least two controllable power semiconductor chips arranged inside the module housing and one after another in a lateral direction, a single main load terminal arranged outside the module housing and electrically connected to the first main electrodes, and an auxiliary terminal arranged outside the module housing and electrically connected to the first main electrodes via an auxiliary terminal connecting conductor.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.