Coating method and solutions for enhanced electromigration resistance
US8405217B2 · kind B2 · utility
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16Claims
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Key dates
| Filing date | Mar 5, 2007 |
| Grant date | Mar 26, 2013 |
| Priority date | — |
| Expiry date | Jun 11, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/76832
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention concerns a methods and compositions for preparing a multi layer composite device, such as a semiconductor device.Said method comprises
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.