Patent · US Active

Process for manufacturing polishing pad

US8409308B2 · kind B2 · utility

3Cited by
15References
2Claims
0Family size

Assignee

Inventors

Key dates

Filing dateMay 15, 2008
Grant dateApr 2, 2013
Priority date
Expiry dateDec 7, 2028

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T428/24364
  • WIPO fieldMachine tools
  • WIPO sectorMechanical engineering

Abstract

A method for manufacturing a polishing pad that has a high level of optical detection accuracy and is prevented from causing slurry leak from between the polishing region and the light-transmitting region includes preparing a cell-dispersed urethane composition by a mechanical foaming method; placing a light-transmitting region at a predetermined position on a face material or a belt conveyor, continuously discharging the cell-dispersed urethane composition onto a part of the face material or the belt conveyor where the light-transmitting region is not placed; placing another face material or belt conveyor on the discharged cell-dispersed urethane composition; curing the cell-dispersed urethane composition to form a polishing region including a polyurethane foam, so that a polishing sheet is prepared; applying a coating composition containing an aliphatic and/or alicyclic polyisocyanate to one side of the polishing sheet and curing the coating composition to form a water-impermeable film; and cutting the polishing sheet.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.