Registered structure formation via the application of directed thermal energy to diblock copolymer films
US8409449B2 · kind B2 · utility
25Cited by
96References
17Claims
0Family size
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Key dates
| Filing date | Dec 27, 2011 |
| Grant date | Apr 2, 2013 |
| Priority date | — |
| Expiry date | Dec 27, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24744
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
Methods for fabricating sub-lithographic, nanoscale linear microchannel arrays over surfaces without defined features utilizing self-assembling block copolymers, and films and devices formed from these methods are provided. Embodiments of the methods use a multi-layer induced ordering approach to align lamellar films to an underlying base film within trenches, and localized heating to anneal the lamellar-phase block copolymer film overlying the trenches and outwardly over the remaining surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.