Process for reactive ion etching a layer of diamond like carbon
US8409458B2 · kind B2 · utility
0Cited by
3References
10Claims
0Family size
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Key dates
| Filing date | Mar 2, 2007 |
| Grant date | Apr 2, 2013 |
| Priority date | — |
| Expiry date | May 1, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D30/601
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
Provided is a process for manufacturing a diamond like carbon layer. The process for manufacturing the diamond like carbon layer includes, without limitation, forming a layer of diamond like carbon over a substrate, and reactive ion etching the layer of diamond like carbon.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.