Patent · US Active

Process for reactive ion etching a layer of diamond like carbon

US8409458B2 · kind B2 · utility

0Cited by
3References
10Claims
0Family size

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Inventors

Key dates

Filing dateMar 2, 2007
Grant dateApr 2, 2013
Priority date
Expiry dateMay 1, 2028

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH10D30/601
  • WIPO fieldTextile and paper machines
  • WIPO sectorMechanical engineering

Abstract

Provided is a process for manufacturing a diamond like carbon layer. The process for manufacturing the diamond like carbon layer includes, without limitation, forming a layer of diamond like carbon over a substrate, and reactive ion etching the layer of diamond like carbon.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.