Method for manufacturing semiconductor chips from a semiconductor wafer
US8409967B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 6, 2011 |
| Grant date | Apr 2, 2013 |
| Priority date | — |
| Expiry date | Oct 14, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T225/393
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for manufacturing semiconductor chips from a semiconductor wafer, including the steps of: fastening, on a first support frame, a second support frame having outer dimensions smaller than the outer dimensions of the first frame and greater than the inner dimensions of the first frame; arranging the wafer on a surface of a film stretched on the second frame; carrying out wafer processing operations by using equipment capable of receiving the first frame; separating the second frame from the first frame and removing the first frame; and carrying out wafer processing operations by using equipment capable of receiving the second frame.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.