Vincent Jarry
11Patents
2h-index
8Co-inventors
43Inventor score
Filing activity: Jul 8, 2010 → Jan 5, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8309403B2 | Method for encapsulating electronic components on a wafer | Electricity | 2 | Active |
| US10444002B2 | Sensor device for geometrically testing parts | Physics | 2 | Active |
| US8486763B2 | Method for thinning and dicing electronic circuit wafers | Emerging Cross-Sectional Technologies | 2 | Active |
| US8319339B2 | Surface-mounted silicon chip | Electricity | 2 | Active |
| US8785297B2 | Method for encapsulating electronic components on a wafer | Electricity | 1 | Active |
| US8409967B2 | Method for manufacturing semiconductor chips from a semiconductor wafer | Emerging Cross-Sectional Technologies | 1 | Active |
| US8772134B2 | Method for manufacturing semiconductor chips from a semiconductor wafer | Emerging Cross-Sectional Technologies | 0 | Active |
| US9356310B2 | Method for forming a microbattery | Emerging Cross-Sectional Technologies | 0 | Active |
| US11251478B2 | Encapsulated flexible thin-film micro-batteries | Emerging Cross-Sectional Technologies | 0 | Active |
| US11575172B2 | Electronic device including interposer substrate carrying mica substrate with battery layer environmentally sealed thereto | Emerging Cross-Sectional Technologies | 0 | Active |
| US10290838B2 | Methods for encapsulating flexible thin-film micro-batteries to protect against environmental intrusion | Emerging Cross-Sectional Technologies | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.