Patent · US Active

Integrated multicomponent device in a semiconducting die

US8409971B2 · kind B2 · utility

0Cited by

12References

18Claims

0Family size

Assignee

COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES · FR

Inventors

Jean-Charles Souriau · Pessac, FR
Francois Baleras · Seyssinet-Pariset, FR

Key dates

Filing date	Jun 5, 2008
Grant date	Apr 2, 2013
Priority date	—
Expiry date	Nov 15, 2029

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/49146
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

An electronic device with integrated discrete components, including a wafer including cavities that can receive the components, an active face of the components being in a same plane as a face of the receiving wafer, and a material for laterally coating the components in the cavities.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.