Electronic device submounts with thermally conductive vias and light emitting devices including the same
US8410371B2 · kind B2 · utility
8Cited by
12References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 8, 2009 |
| Grant date | Apr 2, 2013 |
| Priority date | — |
| Expiry date | Mar 8, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49155
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A submount for an electronic device includes an electrically insulating substrate including first and second surfaces and having a thickness between the first and second surfaces, a thermally conductive pad on the first surface of the substrate, and a thermally conductive via extending from the first surface of the substrate toward the second surface of the substrate and having a length that is less than the thickness of the substrate. The thermally conductive via has a higher thermal conductivity than a thermal conductivity of the substrate. Methods of forming submounts are also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.