Chemical mechanical polisher having movable slurry dispensers and method
US8414357B2 · kind B2 · utility
7Cited by
34References
26Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 22, 2008 |
| Grant date | Apr 9, 2013 |
| Priority date | — |
| Expiry date | Jan 23, 2032 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/042
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A chemical mechanical polisher comprises a polishing platen capable of supporting a polishing pad, and first and second substrate carriers that are each capable of holding a substrate against the polishing pad. First and second slurry dispensers, each comprise (i) an arm comprising a pivoting end and a distal end, (ii) at least one slurry dispensing nozzle on the distal end, and (iii) a dispenser drive capable of rotating the arm about the pivoting end to swing the slurry dispensing nozzle at the distal end to dispense slurry across the polishing platen.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.