Double side polishing apparatus and carrier therefor
US8414360B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 4, 2010 |
| Grant date | Apr 9, 2013 |
| Priority date | — |
| Expiry date | Jun 4, 2031 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/28
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A double side polishing apparatus comprises an upper polishing plate and a lower polishing plate for polishing both sides of a wafer; a plurality of carriers, each including a center plate and a circumferential plate, the center plate having a mounting hole where the wafer is mounted, the circumferential plate having a fitting hole where the center plate is fitted and a gear part formed along the outer periphery thereof, the center of the mounting hole being eccentric from the center of the center plate, the center of the fitting hole being eccentric from the center of the circumferential plate; and a sun gear and an internal gear engaged with the gear part to transmit a rotational force to the plurality of carriers, wherein a fitting direction of a center plate into a fitting hole is adjustable for at least two carriers among the plurality of carriers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.