Method for increasing throughput of solder mask removal by minimizing the number of cleaning pulses
US8415586B2 · kind B2 · utility
2Cited by
32References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 16, 2009 |
| Grant date | Apr 9, 2013 |
| Priority date | — |
| Expiry date | Jan 7, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/28
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
In some embodiments, laser output including at least one laser pulse having a wavelength shorter than 400 microns and having a pulsewidth shorter than 1,000 picoseconds permits the number of pulses used to clean a bottom surface of a via or the surface of a solder pad to increase process throughput. An oscillator module in cooperation with an amplification module may be used to generate the laser output.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.