System for securely dechucking wafers
US8416555B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 25, 2011 |
| Grant date | Apr 9, 2013 |
| Priority date | — |
| Expiry date | Jul 25, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6833
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A system for chucking and de-chucking a work piece comprises a wafer stage having a chuck support for supporting a chuck. The wafer stage further comprises a chuck mounted on the chuck support for receiving and attaching the work piece thereto; a support lift means for supporting the work piece; a driving means coupled to the support lift means for gradually raising the support lift means to contact the work piece in response to a variable quantity; a controller for receiving the variable quantity; and a regulating means coupled to the driving means and to the controller, the regulating means for controlling the variable quantity going to the driving means when a predetermined variable quantity is detected.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.