Inventor · Danei, TW

Pin Chia Su

25Patents
5h-index
44Co-inventors
69Inventor score

Filing activity: Jun 14, 2002 → Feb 17, 2023

Most-cited inventions

PatentTitleAreaCited byStatus
US7588946B2 Controlling system for gate formation of semiconductor devices Electricity 25 Expired
US6777334B2 Method for protecting a wafer backside from etching damage Electricity 11 Expired
US7973293B2 Implantation quality improvement by xenon/hydrogen dilution gas Electricity 6 Active
US7306746B2 Critical dimension control in a semiconductor fabrication process Electricity 5 Expired
US7995323B2 Method and apparatus for securely dechucking wafers Electricity 5 Active
US8416555B2 System for securely dechucking wafers Electricity 4 Active
US8816415B2 Photodiode with concave reflector Electricity 4 Active
US7018928B2 Plasma treatment method to reduce silicon erosion over HDI silicon regions Electricity 3 Expired
US8000081B2 Method and apparatus for safely dechucking wafers Electricity 2 Active
US6808589B2 Wafer transfer robot having wafer blades equipped with sensors Electricity 2 Expired
US11949000B2 Metal gate structures and methods of fabricating the same in field-effect transistors Electricity 1 Active
US8884390B2 Backside illumination image sensor chips and methods for forming the same Electricity 1 Active
US7910014B2 Method and system for improving wet chemical bath process stability and productivity in semiconductor manufacturing Electricity 1 Active
US11588038B2 Circuit structure with gate configuration Electricity 1 Active
US9142588B2 Backside illumination image sensor chips and methods for forming the same Electricity 1 Active
US7101748B2 Method of integrating the formation of a shallow junction N channel device with the formation of P channel, ESD and input/output devices Electricity 0 Expired
US8696930B2 Silicon wafer reclamation process Electricity 0 Active
US9240503B2 Methods of manufacturing and using a photodiode with concave reflector Electricity 0 Active
US11476351B2 Metal gate structures and methods of fabricating the same in field-effect transistors Electricity 0 Active
US7851374B2 Silicon wafer reclamation process Electricity 0 Active
US8049213B2 Feature dimension measurement Electricity 0 Active
US12021130B2 Circuit structure with gate configuration Electricity 0 Active
US9450014B2 Backside illumination image sensor chips and methods for forming the same Electricity 0 Active
US12113120B2 Gate electrode having a work-function layer including materials with different average grain sizes Electricity 0 Active
US11502185B2 Methods of manufacturing a gate electrode having metal layers with different average grain sizes Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.