Embedded semiconductor power modules and packages
US8421204B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 18, 2011 |
| Grant date | Apr 16, 2013 |
| Priority date | — |
| Expiry date | May 18, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/185
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed are semiconductor die packages constructed from modules of embedded semiconductor dice and electrical components. In one embodiment, a semiconductor die package comprises a first module and a second module attached to the first module. One or more semiconductor dice are embedded in the first module, and one or more electrical components, such as surface-mounted components, are embedded in the second module. The first module may be formed by a lamination process, and the second module may be formed by a lamination process or a molding process. Patterned metal layers and vias provide electrical interconnections to the package and among the die and components of the package. The second module may be attached to the first module by coupling interconnect lands of separately manufactured modules to one another, or may be directly attached by lamination or molding.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.