Apparatus for manufacturing semiconductor package for wide lead frame and method of constructing semiconductor package using the same
US8424195B2 · kind B2 · utility
2Cited by
11References
20Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 26, 2009 |
| Grant date | Apr 23, 2013 |
| Priority date | — |
| Expiry date | Feb 12, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53687
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus for manufacturing a semiconductor package includes an index rail transferring a lead frame in forward and backward directions, the lead frame having a first surface and a second surface that is opposite to the first surface, a loader portion connected to an end portion of the index rail and supplying the lead frame to the index rail, a frame driving portion connected to the opposite end portion of the end portion of the index rail and rotating the lead frame around a normal to the first surface, and a die attach portion attaching a semiconductor chip on the lead frame supplied to the index rail.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.