Patent assignee · KR · COMPANY

STS SEMICONDUCTOR & TELECOMMUNICATIONS CO., LTD.

16Patents
16Active
16Granted
47Portfolio score

Filing activity: Feb 26, 2009 → Feb 25, 2016 · 3 expiring within 5 years

Most-cited patents

PatentTitleAreaCited byStatus
US9466586B1 Method for manufacturing wafer-level fan-out package Electricity 32 Active
US8941225B2 Integrated circuit package and method for manufacturing the same Electricity 14 Active
US8912662B2 Wafer-level package and method of manufacturing the same Electricity 8 Active
US9905436B2 Wafer level fan-out package and method for manufacturing the same Electricity 8 Active
US8952514B2 Semiconductor package Electricity 4 Active
US9449911B1 Fan-out wafer level package and manufacturing method thereof Electricity 4 Active
US8222120B2 Method of dicing wafer using plasma Electricity 4 Active
US9905551B2 Method of manufacturing wafer level packaging including through encapsulation vias Electricity 2 Active
US8742551B2 Semiconductor package and method of manufacturing the same Electricity 2 Active
US8424195B2 Apparatus for manufacturing semiconductor package for wide lead frame and method of constructing semiconductor package using the same Emerging Cross-Sectional Technologies 2 Active
US7934632B2 Apparatus for manufacturing semiconductor package for wide lead frame and method of constructing semiconductor package using the same Electricity 1 Active
US8202744B2 Wafer through silicon via forming method and equipment therefor Electricity 0 Active
US9349667B2 Method of manufacturing stacked package Electricity 0 Active
US9024452B2 Semiconductor package comprising an interposer and method of manufacturing the same Electricity 0 Active
US8802498B2 Method of manufacturing semiconductor package having no chip pad Electricity 0 Active
US8785254B2 Method of manufacturing high-capacity semiconductor package Electricity 0 Active

Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.