Curable flux composition and method of soldering
US8430295B2 · kind B2 · utility
2Cited by
30References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 30, 2011 |
| Grant date | Apr 30, 2013 |
| Priority date | — |
| Expiry date | Sep 30, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10977
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A curable flux composition is provided, comprising, as initial components: a resin component having at least two oxirane groups per molecule; a carboxylic acid; a fluxing agent represented by formula I:wherein R1, R2, R3 and R4 are independently selected from a hydrogen, a substituted C1-80 alkyl group, an unsubstituted C1-80 alkyl group, a substituted C7-80 arylalkyl group and an unsubstituted C7-80 arylalkyl group; and wherein zero to three of R1, R2, R3 and R4 is(are) a hydrogen; and, optionally, a curing agent. Also provided is a method of soldering an electrical contact using the curable flux composition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.