Die mounting assembly formed of dissimilar materials
US8430474B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 10, 2010 |
| Grant date | Apr 30, 2013 |
| Priority date | — |
| Expiry date | Jun 3, 2031 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2202/14
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A mounting assembly for a microelectronic device, the mounting assembly includes (a) a first member formed of a first material having a first coefficient of thermal expansion, the first member including i) a mounting surface for the microelectronic device; ii) a wall that adjoins the mounting surface and that is recessed from the mounting surface; and iii) an extension of the mounting surface that extends beyond an end of the wall; and (b) a second member formed of a plastic material having a second coefficient of thermal expansion that is larger than the first coefficient of thermal expansion, wherein a first portion of the second member is attached to the extension.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.