Self-aligned spacer multiple patterning methods
US8431329B2 · kind B2 · utility
19Cited by
2References
15Claims
0Family size
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Key dates
| Filing date | Jun 28, 2010 |
| Grant date | Apr 30, 2013 |
| Priority date | — |
| Expiry date | Apr 6, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/0338
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Self-aligned spacer multiple patterning method are provided. The methods involve alkaline treatment of photoresist patterns and allow for the formation of high density resist patterns. The methods find particular applicability in semiconductor device manufacture.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.