Patent · US Active

Stencil mask profile

US8431495B2 · kind B2 · utility

0Cited by

1References

6Claims

0Family size

Assignee

Varian Semiconductor Equipment Associates, Inc. · US

Inventors

Helen L. Maynard · North Reading, US
George D. Papasouliotis · Fishkill, US

Key dates

Filing date	Jul 8, 2010
Grant date	Apr 30, 2013
Priority date	—
Expiry date	Jun 29, 2031

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC23C16/042
WIPO fieldSurface technology, coating
WIPO sectorChemistry

Abstract

An apparatus and method are provided which allow the low cost patterned deposition of material onto a workpiece. A stencil mask, having chamfered edges is applied to the surface of the workpiece. The material is then deposited onto the workpiece, such as by PECVD. Because of the chamfered edges, the material thickness is much more uniform than is possible with traditional stencil masks. Stencil masks having a variety of cross sectional patterns are disclosed which improve deposition uniformity.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.