Patent · US Active

Integrated circuit including bond wire directly bonded to pad

US8432024B2 · kind B2 · utility

0Cited by

8References

9Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Manfred Schneegans · Vaterstetten, DE
Lothar Koenig · Hemau, DE

Key dates

Filing date	Apr 27, 2010
Grant date	Apr 30, 2013
Priority date	—
Expiry date	Dec 3, 2030

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/20109
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

An integrated circuit includes a chip including a copper bond pad metallization, and a copper bond wire including a copper ball. The copper ball is bonded directly to the copper bond pad.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.