Extending the lifetime of a deep UV laser in a wafer inspection tool
US8432944B2 · kind B2 · utility
5Cited by
2References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 6, 2011 |
| Grant date | Apr 30, 2013 |
| Priority date | — |
| Expiry date | Sep 20, 2031 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N21/9501
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Disclosed herein is a method and apparatus for automatic correction of beam waist position drift in real time, using wafer inspection data taken during normal tool operation. Also disclosed herein is an improved laser astigmatism corrector for use either internal or external to the laser.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.