Methods and systems for supporting a workpiece and for heat-treating the workpiece
US8434341B2 · kind B2 · utility
4Cited by
224References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 27, 2012 |
| Grant date | May 7, 2013 |
| Priority date | — |
| Expiry date | Jan 27, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68757
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus for supporting a semiconductor workpiece includes a heating system configured to cause thermally-induced motion of the semiconductor workpiece by heating a surface of the workpiece relative to a bulk of the workpiece. The thermally-induced motion includes vertical motion of an outer edge region of the workpiece and a center of the workpiece relative to each other. The apparatus further includes a support system configured to allow the thermally-induced motion including the vertical motion of the outer edge region of the workpiece and the center of the workpiece relative to each other while supporting the workpiece.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.