Storing package unit and a storing method for micro solder spheres
US8434614B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 26, 2009 |
| Grant date | May 7, 2013 |
| Priority date | — |
| Expiry date | Jan 20, 2030 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB65D81/268
- WIPO fieldHandling
- WIPO sectorMechanical engineering
Abstract
An object of the present invention is to prevent “deteriorations,” such as oxidization and deformation of micro solder spheres during storage.The micro solder spheres are packed in a container 2 comprising an air permeable material. A deoxidizing and drying agent 3 to be disposed externally to the container 2 is provided. The container 2 and the deoxidizing and drying agent 3 are placed in a bag member 4 impermeable to air, and the bag member 4 is sealed in an air-tight condition. Before sealing, the bag member 4 may be air evacuated. A plurality of containers 2 may be held by a holding member 5 such that they are fixed in positions relative to each other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.