Daisuke Souma
6Patents
3h-index
17Co-inventors
50Inventor score
Filing activity: Apr 15, 2004 → Sep 10, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7282175B2 | Lead-free solder | Performing Operations; Transporting | 18 | Expired |
| US7750475B2 | Lead-free solder ball | Electricity | 5 | Expired |
| US8434614B2 | Storing package unit and a storing method for micro solder spheres | Performing Operations; Transporting | 3 | Active |
| US11495566B2 | Core material, electronic component and method for forming bump electrode | Electricity | 1 | Active |
| US11478869B2 | Method for forming bump electrode substrate | Electricity | 0 | Active |
| US11872656B2 | Core material, electronic component and method for forming bump electrode | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.