Optimization of desiccant usage in a MEMS package
US8435838B2 · kind B2 · utility
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37References
16Claims
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Key dates
| Filing date | Sep 28, 2007 |
| Grant date | May 7, 2013 |
| Priority date | — |
| Expiry date | Aug 6, 2028 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C1/00674
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A MEMS device may be package with a desiccant to provide a moisture-free environment. In order to avoid undesirable effects on the MEMS device, the desiccant may be selected or treated so as to be compatible with a particular MEMS device. This treatment may include baking of the desiccant to as to cause outgassing of moisture or other undesirable material. The structure of the MEMS device may also be altered to improve compatibility with particular desiccants.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.