Solder joint reliability in microelectronic packaging
US8436470B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 8, 2010 |
| Grant date | May 7, 2013 |
| Priority date | — |
| Expiry date | Nov 16, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A microelectronic assembly and method for fabricating the same are described. In an example, a microelectronic assembly includes a microelectronic device having a surface with one or more areas to receive one or more solder balls, the one or more areas having a surface finish comprising Ni. A solder material comprising Cu, such as flux or paste, is applied to the Ni surface finish and one or more solder balls are coupled to the microelectronic device by a reflow process that forms a solder joint between the one or more solder balls, the solder material comprising Cu, and the one or more areas having a surface finish comprising Ni.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.