Patent · US Active

Interchangeable connection arrays for double-sided DIMM placement

US8438515B2 · kind B2 · utility

5Cited by

4References

9Claims

0Family size

Assignee

Intel Corporation · US

Inventors

Michael W. Leddige · Beaverton, US
Kuljit S. Bains · DuPont, US
John T. Sprietsma · Portland, US

Key dates

Filing date	Dec 29, 2011
Grant date	May 7, 2013
Priority date	—
Expiry date	Dec 29, 2031

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY02P70/50
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

A memory module has an array of connections. The array of connections is arranged in rows and columns such that there are first and second outer columns. Connections in the first and second outer columns can be interchanged to optimize double-side module placement on a substrate. Other embodiments are also disclosed and claimed.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.