Multilayer printed circuit board and multilayer printed circuit board manufacturing method
US8438727B2 · kind B2 · utility
2Cited by
93References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 1, 2009 |
| Grant date | May 14, 2013 |
| Priority date | — |
| Expiry date | Oct 1, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing a multilayer printed circuit board having interlayer insulating layers and conductor layers repeatedly formed on a substrate, via holes formed in the interlayer insulating layers, and establishing electrical connection through the via holes, including containing an electronic component in said substrate, forming a positioning mark on said substrate based on a positioning mark of said electronic component, and conducting working or formation based on the positioning mark of said substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.