Method of protecting printhead die face
US8438730B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jan 26, 2011 |
| Grant date | May 14, 2013 |
| Priority date | — |
| Expiry date | Nov 14, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49401
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A method of assembling an inkjet printhead comprising providing a printhead chassis; providing a support surface; affixing a printhead die to a die location portion of the support surface; affixing a portion of an attachment surface of a flexible circuit to the support surface adjacent to the die location portion of the support surface; electrically connecting the printhead die to the flexible circuit; affixing a spacer member to a surface of the flexible circuit that is opposite the attachment surface; applying an encapsulating material in contact with the printhead die, the flexible circuit, and the spacer member; and curing the encapsulating material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.