Patent · US Active

Re-establishing surface characteristics of sensitive low-k dielectrics in microstructure device by using an in situ surface modification

US8440579B2 · kind B2 · utility

1Cited by
2References
17Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJul 8, 2011
Grant dateMay 14, 2013
Priority date
Expiry dateOct 18, 2031

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L21/02126
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

Patterning-induced damage of sensitive low-k dielectric materials in semiconductors devices may be restored to a certain degree on the basis of a surface treatment that is performed prior to exposing the device to ambient atmosphere. To this end, the dangling silicon bonds of the silicon oxide-based low-k dielectric material may be saturated in a confined process environment, thereby providing superior surface conditions for the subsequent application of an appropriate repair chemistry.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.