Package carrier and manufacturing method thereof
US8441121B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Apr 8, 2011 |
| Grant date | May 14, 2013 |
| Priority date | — |
| Expiry date | May 31, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/8582
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A manufacturing method of a package carrier is provided. A first opening communicating an upper surface and a lower surface of a substrate is formed. A heat-conducting element having a top surface and a bottom surface is configured in the first opening and fixed into the first opening via an insulation material. A first insulation layer and a first metal layer are laminated onto the upper surface. A second insulation layer and a second metal layer are laminated onto the lower surface. A second opening and a third opening respectively exposing portions of the top and the bottom surfaces are formed. At least one through via passing through the first metal layer, the first insulation layer, the substrate, the second insulation layer and the second metal layer is formed. A third metal layer covering the first and second metal layers and an inner wall of the through via is formed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.